SEIZET Technology(Shen Zhen) Co.,LTD.
Introduction of a new generation of intelligent cutting equipment
3C product testing
Chip packaging inspection
Circuit board defect detection
Intelligent non-teaching cutting groove
Trajectory guide cut bevel
Unordered grabbing of bars
Disorderly grabbing the outer cage of the deep material frame
Crankshaft grabbing disorderly
Introduction of a new generation of intelligent cutting equipment
3C product testing
Chip packaging inspection
Circuit board defect detection
Intelligent non-teaching cutting groove
Trajectory guide cut bevel
Unordered grabbing of bars
Disorderly grabbing the outer cage of the deep material frame
Crankshaft grabbing disorderly
If you have any questions, we are at your service