SEIZET Technology(Shen Zhen) Co.,LTD.
The 3D line spectrum confocal sensor is used to measure the thickness, flatness, micro-topography, micro-defects, warpage, etc. of objects. It is suitable for various high-precision measurement scenarios, such as high reflection, mirror surface, transparency, bending, tilt, Diffuse reflection, color, roughness, high contrast, can also measure the thickness and voids of transparent coatings. SZ-Spec series line spectrum confocal 3D imaging system is mainly used to solve the problem of 3D contour precision measurement, and meet the measurement and inspection needs of semiconductor, 3D glass, precision dispensing, precision parts and so on.
Ultra-high-speed measurement calculation module, frame rate up to 2000Hz
Complete point cloud post-processing algorithm built-in in the software
Achieve sub-micron repeatability
±25° wide angle adaptability, suitable for a variety of work scenarios
Integrated design for complex and high-volume industrial applications, easy to integrate into various inspection systems Among them
Complete SDK and technical support, customized after-sales service
| Sensor model | SZ-Spec-2 | SZ-Spec-5 | SZ-Spec-10 |
| Line length | 2.2mm | 5.2mm | 10.4mm |
| Range | 2.0mm | 1.4mm | 1.6mm |
| Spot size | 10.0μm | 4.0μm | 8.0um |
| Point interval | 11.0μm | 10.0μm | 20.0um |
| Horizontal resolution | 5.0μm | 2.0μm | 4.0um |
| Axial resolution | 1.0μm | 0.7μm | 0.8um |
| Precision | 0.3μm | 0.2um | 0.3um |
| Maximum measuring inclination | ±20° | ±35° | ±20° |
| Full-scale scan speed | 250Hz | 1000Hz | 1000Hz |
| Maximum scanning speed | 500Hz | 2000Hz | 2000Hz |
| Working distance | 18.0mm | 5.0mm | 8.0mm |
| size | 480mm×170mm×80mm | 590mm×285mm×120mm | 620mm×285mm×120mm |
| weight | 4.5kg | 19.0kg | 19.5kg |
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With the continuous rise of technology, the packaging and testing industry, the downstream of the semiconductor supply chain, has broken through the traditional packaging technology in recent years, achieving flip-chip (FlipChip), bumping (Bumping), wafer level packaging (Waferlevelpackage), 2.5D packaging (interposer) , RDL, etc.), 3D packaging and other advanced packaging technologies. Typical 3D packaging structures include stacked chips with through-silicon vias (TSV), micro-bump interconnect stacked chips, etc. The traditional 2.5DAOI inspection equipment has been unable to meet the inspection requirements of advanced packaging processes.
Mobile phones, tablets, watches, Bluetooth headsets, etc. in the 3C industry all need to test their dispensing and appearance.
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