SEIZET Technology(Shen Zhen) Co.,LTD.
With the continuous rise of technology, the packaging and testing industry, the downstream of the semiconductor supply chain, has broken through the traditional packaging technology in recent years, achieving flip-chip (FlipChip), bumping (Bumping), wafer level packaging (Waferlevelpackage), 2.5D pa...
check the detailsMobile phones, tablets, watches, Bluetooth headsets, etc. in the 3C industry all need to test their dispensing and appearance.
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